Core tip: the epoxy resin adhesive cured at room temperature and the heat resistant varieties, mainly general bisphenol A epoxy resin, a high degree of epoxy resin, silicone modified epoxy resin, but there are also some other varieties, add other types of heat-resistant resin in epoxy adhesive, such as phenolic resin, polysulfone can also improve heat resistance of;

The epoxy resin adhesive cured at room temperature and the heat resistant varieties, mainly general bisphenol A epoxy resin, a high degree of epoxy resin, silicone modified epoxy resin, but there are also some other varieties, add other types of heat-resistant resin in epoxy adhesive, such as phenol formaldehyde resin, polysulfone can improve the heat resistance;

Another way is to add polyimide or imide compound to epoxy matrix, or use it as curing agent, so as to improve the thermal stability and flame retardance of epoxy resin. Three phenyl phosphine and methyl ethyl ketone were used as catalysts and solvents abroad to make the maleimide with hydroxyl group and epoxy group simply add reaction to get interpenetrating network structure. The synthesis of phenol formaldehyde resin modified by epoxy resin, butadiene -40, polyvinyl butyral as the first component, composite polyamine curing agent as the adhesive component B, capable of curing at room temperature, contact pressure, bonding strength and heat resistance is high, suitable for heat resistant materials, friction materials, metal parts composite packaging materials such as adhesive.